Intersect into a very sharp cutting edge of about 4mm in length. The carbide cleaver is made from a solid carbide rod. Ground and polished natural diamond has a 90° included angle with a relief angle of 30°. The Retractable Diamond cleaver is retained in a quality metal casing with pocket clasp. The precision hand-held instruments can be used for scoring and cleaving all types of optical fiber Useful for reaching into and in between high density commponents. Wheel cutters produce a cleaner scribe line than point scribes and minimize the number of particles generated. This cutter excels at cutting ultra-thin glass, as well as hard glass, quartz, silicon and III-V semiconductors. Good for very thin glass 0.03mm up to 2mm and hard glass 0.3-2mm. For this cutter, a sharper tip angle allows for a narrower scribe line. This allows for a non-slip start and deeper scoring. Laser refers to the profile applied to the wheel.
This cutter excels at cutting thin glass, hard glass, quartz, silicon and III-V semiconductors. Good for glass 0.1-2mm and hard glass 0.3-2mm. In this carbide wheel cutter, Laser refers to the profile applied to the wheel. Wheel cutters produce a cleaner scribe line than pointed scribe, minimizing the number of particles produced. Suitable for glass 0.3-1.5mm and hard glass 0.3-6mm. General purpose tungsten carbide cutter for glass, silicon, and other crystalline materials. The scribe tip is an 8-point diamond, allowing flexibility to meet demanding scribing requirements and long tool life. The LatticeScriber™ is the optimal tool for scribing silicon, III-V semiconductors, and similar materials. Diamond Scriber Head: Straight Diamond Tip Included Angle: 90° Overall Length: 17.1cm (6.75")
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